Next Gen iPhone Components Shows 3.2mp Camera, Infineon Chip
Digitimes (via MacRumors) has put together a list of which supplier is providing what part — they think! — for Apple’s next generation iPhone, ever-increasingly assumed to be announced at WWDC in June. No huge surprises, with iPhone 2G and 3G stalwart Infineon continuing to make the baseband (guess a home-spun PA Semi chip isn’t entirely replacing them yet), and Samsung to provide the NAND Flash storage.
Those hyped about the rumors of a possible 5.0 megapixel camera on board, however, take note of the 3.2 spec noted above. No replacing those Canon 5D Mark II’s yet!
April 14th, 2009 at 8:52 am
interesting…..
April 14th, 2009 at 8:57 am
April 14th, 2009 at 10:08 am
3.2 would be nice. More interested in a all round snappier phone (faster shutter, etc).
April 14th, 2009 at 12:05 pm
3.2 won’t make me run out to upgrade my 3g that’s for sure. I doubt any camera would though
April 14th, 2009 at 1:16 pm
Why not a 5mp camera like the Nokias have had for a year already. Is there really a big difference from 2 to 3
April 14th, 2009 at 1:35 pm
I agree with John. There isn’t much of a difference from 2.0 to 3.2 unless you make it autofocus. Adding a flash would be nice also.
April 14th, 2009 at 4:09 pm
The app needs to be faster as well. I want effects for the photos as well. Basically a Mobile Photobooth.