Phone different Podcast Episode 39
News
- iPhone 3.0
- iPhone 3.0 Walkthrough Now Updated to Beta 5
- Apple Recruiting Developers to Beta Test Push Notification
- And we’ve got the screenshots to show it!
- But is Apple reconsidering and thinking of allowing limited background multitasking? We’ve got three rumors saying… maybe!
- If you’re not a developer and are running iPhone 3.0, and have hardware issues, don’t count on the Apple Store!
- iPhone: Next Gen Rumorpalooza Part XXVI
- Daring Fireball Weighs in on Next Gen iPhone
- Asahi Kasei Confirmed for Digital Compass
- Super-Rumor: Next Gen iPhone due in store July 17 + Glowing Apple logo?
- Apple Jobs Wanted: Faster, More Powerful iPhone Processor Architect + Embedded Video Engineer
- Palm Pre Pressuring Apple to Pressure AT&T to Lower Rates for Next Gen iPhone?
- Rumorous Maximus: iPhone Models to be Differentiated by Software?
- And in Other News…
- Speaking of Palm Pre: it launches June 6, two days before WWDC. Timing much?
- Eucalyptus Rejected! Or, Do iPhone App Store Reviewers Spend Their Time Searching for Porn?
- iPhone Easter Eggs Could Kill App Store Golden Egg?
- Apple Hiring At-Home Experts from July to September just in time for…? iPhone Doubles Share of Smartphone Market
- Fraudulent “iTunes” Alert — Check Your Charges!
TiPb Forums
- This week, Jeremy shone the spotlight on: iPhone on Verizon Soon? Bored of Your iPhone? WWDC and New iPhone?
- Check out our awesome forum reviews for Myst and Twittelator Pro, and don’t miss the huge Forum Reviews index
Credits
Thanks to the the iPhone Blog Store for sponsoring the podcast.
Our music comes from the following sources:
May 22nd, 2009 at 5:14 pm
On the podcast there was some discussion about how/where Apple would fit the extra memory for the 32GIG into the iPhone.
I just wanted to point out this article: http://www.mydigitallife.info/2008/08/10/toshiba-unveiled-highest-memory-capacity-nand-flash-memory-devices-for-consumer-markets/
In this article the dimensions of the 32Gig chip is 8mm X 14mm X 1.4mm. This is identical to the 16gig chip used on the current phone. (Which is located on the back side of the main motherboard, just behind the sim slot).
So no problem fitting this in.
The 32GB package is fabbed using a 43-nm process, but Tosh has already announced a 32-nm line, so fitting 64GB in the same space will be possible in short order, if not already.